Patent Assignment
Reel/Frame 053504/0162
Assignment of Assignor's Interest
Recorded: 2020-08-14
Pages: 2
Assignors
CHUANG, CHI-YI
Executed: 2020-08-05
CHEN, HOU-YU
Executed: 2020-08-05
CHENG, KUAN-LUN
Executed: 2020-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packaged Semiconductor Devices Including Backside Power Rails and Methods of Forming the Same