Patent Assignment
Reel/Frame 053506/0040
Assignment of Assignor's Interest
Recorded: 2020-08-15
Pages: 6
Assignors
KIM, EUIJIN
Executed: 2020-03-24
KIM, HYUNGJONG
Executed: 2020-03-24
PARK, JUNO
Executed: 2020-03-24
HEO, SEOK
Executed: 2020-03-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Transferring Wafer, Method for Transferring Wafer Using the Same with Three Sensors