Patent Assignment
Reel/Frame 053508/0386
Assignment of Assignor's Interest
Recorded: 2020-08-17
Pages: 4
Assignors
HSU, WEN-SUNG
Executed: 2018-10-18
CHENG, TAO
Executed: 2018-10-18
CHEN, NAN-CHENG
Executed: 2018-10-18
CHOU, CHE-YA
Executed: 2018-10-18
WU, WEN-CHOU
Executed: 2018-10-18
LU, YEN-JU
Executed: 2018-10-18
HUNG, CHIH-MING
Executed: 2018-10-18
HSU, WEI-HSIU
Executed: 2018-10-18
Assignee
MEDIATEK INC.
NO.1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package with Layer Structures, Antenna Layer and Electronic Component