Patent Assignment
Reel/Frame 053510/0835
Assignment of Assignor's Interest
Recorded: 2020-08-17
Pages: 6
Assignors
LEE, SHLE-GE
Executed: 2020-07-09
KIM, YOUNGBAE
Executed: 2020-07-09
JANG, AE-NEE
Executed: 2020-07-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Module Heatspreading Lid Having Integrated Separators for Multiple Chips