Patent Assignment
Reel/Frame 053537/0126
Assignment of Assignor's Interest
Recorded: 2020-08-19
Pages: 8
Assignors
WANG, YUN-HSIANG
Executed: 2020-08-07
TSAI, CHUN LIN
Executed: 2020-08-18
YU, JIUN-LEI JERRY
Executed: 2020-08-18
CHEN, PO-CHIH
Executed: 2020-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Front-End-Of-Line (Feol) Through Semiconductor-on-Substrate via (Tsv)