Patent Assignment
Reel/Frame 053544/0468
Assignment of Assignor's Interest
Recorded: 2020-08-19
Pages: 3
Assignors
AGGARWAL, SANJEEV
Executed: 2018-09-19
DESHPANDE, SARIN A
Executed: 2018-09-19
NAGEL, KERRY JOSEPH
Executed: 2018-09-20
Assignee
EVERSPIN TECHNOLOGIES, INC.
5670 W. CHANDLER BLVD., SUITE 100, CHANDLER, ARIZONA, 85226
Covered Property
(1)
Method of Manufacturing Integrated Circuit Using Encapsulation During an Etch Process