Patent Assignment
Reel/Frame 053554/0960
Assignment of Assignor's Interest
Recorded: 2020-08-20
Pages: 4
Assignors
CHEN, MING-HUNG
Executed: 2020-05-15
JIAN, HUI-PING
Executed: 2020-05-15
QIU, WEI-ZHEN
Executed: 2020-05-15
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package Including Conductive Layers as Shielding and Method of Manufacturing the Same