Patent Assignment
Reel/Frame 053562/0298
Assignment of Assignor's Interest
Recorded: 2020-08-21
Pages: 2
Assignor
JUNG, CHUNGHYO
Executed: 2020-05-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Heat Dissipation Structure