Patent Assignment
Reel/Frame 053571/0729
Assignment of Assignor's Interest
Recorded: 2020-08-24
Pages: 4
Assignors
HSU, WU CHOU
Executed: 2020-06-15
LEE, CHIH-CHENG
Executed: 2020-06-15
CHEN, MIN-YAO
Executed: 2020-06-15
TIEN, HSING KUO
Executed: 2020-06-15
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package Substrate, Electronic Device Package and Method for Manufacturing the Same