Patent Assignment
Reel/Frame 053578/0517
Assignment of Assignor's Interest
Recorded: 2020-08-24
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Device and Encapsulant