Patent Assignment
Reel/Frame 053588/0919
Assignment of Assignor's Interest
Recorded: 2020-08-25
Pages: 6
Assignors
KIM, TAEWOOK
Executed: 2020-05-25
LEE, JONGHO
Executed: 2020-05-25
OH, JEONGJOON
Executed: 2020-05-25
HWANG, HYEON
Executed: 2020-05-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages with Chips Partially Embedded in Adhesive