Patent Assignment
Reel/Frame 053596/0483
Corrective Assignment to Correct the Assignee Address Previously Recorded at Reel: 053568 Frame: 0910. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2020-08-25
Pages: 7
Assignor
LEE, WON SANG
Executed: 2020-08-21
Assignee
RFHIC CORPORATION
RFHIC BUILDING, 41-14, BURIM-RO 170 BEON-GIL, GWANYANG-DONG DONGAN-GU ANYANG-SI GYEONGGI-DO, ANYANG-SI, 14055, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming a Semiconductor Wafer Containing a Gallium-Nitride Layer and Two Diamond Layers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.