Patent Assignment
Reel/Frame 053603/0112
Assignment of Assignor's Interest
Recorded: 2020-08-26
Pages: 2
Assignors
CHANG, CHE-LUN
Executed: 2020-08-17
LEE, WEI-YANG
Executed: 2020-08-17
LIN, CHIA-PIN
Executed: 2020-08-17
PENG, YUAN-CHING
Executed: 2020-08-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices Including Backside Vias and Methods of Forming the Same