IP Library Assignment 053607/0591
Patent Assignment
Reel/Frame 053607/0591

Assignment of Assignor's Interest

Recorded: 2020-08-26 Pages: 10
Assignors
TAI, ENYONG
Executed: 2020-08-22
TAKIAR, HEM P.
Executed: 2020-08-26
WANG, LI
Executed: 2020-08-23
NG, HONG WAN
Executed: 2020-08-22
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Overlapping Die Stacks for Nand Package Architecture
Application: 17/003,789 →
Publication: US 2022/0068877