Patent Assignment
Reel/Frame 053615/0440
Assignment of Assignor's Interest
Recorded: 2020-08-27
Pages: 6
Assignors
CHEN, JUI-TZU
Executed: 2020-07-22
LIN, YU-HSING
Executed: 2020-07-30
HU, CHIA-CHIEH
Executed: 2020-07-22
KUO, CHUN-CHENG
Executed: 2020-07-22
CHAO, YU-HSIANG
Executed: 2020-07-22
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Structure Having Stiffener with Two or More Contact Points for Heat Dissipating Element