Patent Assignment
Reel/Frame 053626/0203
Assignment of Assignor's Interest
Recorded: 2020-08-28
Pages: 5
Assignors
CHU, YUNG-CHI
Executed: 2020-08-25
LIAO, SIH-HAO
Executed: 2020-06-29
WANG, PO-HAN
Executed: 2020-06-24
HU, YU-HSIANG
Executed: 2020-06-24
KUO, HUNG-JUI
Executed: 2020-06-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Sensor Package and Method