IP Library › Assignment 053635/0287
Patent Assignment
Reel/Frame 053635/0287

Assignment of Assignor's Interest

Recorded: 2020-08-28 Pages: 3
Assignors
PARK, HYE HUN
Executed: 2020-08-11
OH, WON KUEN
Executed: 2020-08-11
LEE, TAE GYEOM
Executed: 2020-08-11
JO, JI HONG
Executed: 2020-08-11
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Ceramic Electronic Parts with Conductive Resin
Application: 17/005,775 →
Publication: US 2021/0090804