Patent Assignment
Reel/Frame 053642/0097
Assignment of Assignor's Interest
Recorded: 2020-08-31
Pages: 6
Assignors
HONG, JISEOK
Executed: 2020-07-06
LEE, HYUEKJAE
Executed: 2020-07-06
HONG, JONGPA
Executed: 2020-06-09
HWANG, JIHWAN
Executed: 2020-06-09
KIM, TAEHUN
Executed: 2020-07-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Improved Reliability in Bonds Betwen Connection Conductors and Pads