Patent Assignment
Reel/Frame 053645/0040
Assignment of Assignor's Interest
Recorded: 2020-08-31
Pages: 3
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Semiconductor Device Assembly with Graded Modulus Underfill and Associated Methods and Systems