Patent Assignment
Reel/Frame 053660/0518
Assignment of Assignor's Interest
Recorded: 2020-09-01
Pages: 2
Assignor
TAGAMI, MASAYOSHI
Executed: 2020-08-19
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Including Bonding Pads and Method of Manufacturing the Same