Patent Assignment
Reel/Frame 053660/0740
Assignment of Assignor's Interest
Recorded: 2020-09-01
Pages: 6
Assignors
PARK, YONGJIN
Executed: 2020-06-23
KANG, MYUNGSAM
Executed: 2020-06-23
KO, YONGCHAN
Executed: 2020-06-23
LEE, SEONHO
Executed: 2020-06-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Heat Dissipation Structure