Patent Assignment
Reel/Frame 053682/0271
Assignment of Assignor's Interest
Recorded: 2020-09-03
Pages: 3
Assignors
JENG, SHIN-PUU
Executed: 2020-08-11
HSU, FENG-CHENG
Executed: 2020-08-03
CHEN, SHUO-MAO
Executed: 2020-08-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure with Cavity in Interposer