Patent Assignment
Reel/Frame 053694/0350
Assignment of Assignor's Interest
Recorded: 2020-09-04
Pages: 2
Assignors
CHEN, MING-FA
Executed: 2020-08-13
LIU, TZUAN-HORNG
Executed: 2020-08-11
SHIH, CHAO-WEN
Executed: 2020-08-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Device Having an Interconnect Structure Over a Substrate