Patent Assignment
Reel/Frame 053697/0962
Assignment of Assignor's Interest
Recorded: 2020-09-04
Pages: 8
Assignors
KOELLING, FRED
Executed: 2020-01-07
NOLET, ALAN D.
Executed: 2019-02-20
LONG, DANIEL
Executed: 2019-02-25
Assignee
SAMTEC, INC.
520 PARK EAST BOULEVARD, NEW ALBANY, INDIANA, 47150
Covered Properties
(2)
Method For Creating Through-Connected Vias And Conductors On A Substrate
Method for Creating Through-Connected Vias and Conductors on a Substrate