Patent Assignment
Reel/Frame 053702/0844
Assignment of Assignor's Interest
Recorded: 2020-09-03
Pages: 7
Assignors
KIM, OHHAN
Executed: 2017-03-15
KIM, KYUNGHWAN
Executed: 2017-03-15
BEAK, WOONJAE
Executed: 2017-03-15
LEE, HUNTEAK
Executed: 2017-03-15
YOON, INSANG
Executed: 2017-03-15
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming SIP Module Over Film Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.