Patent Assignment
Reel/Frame 053704/0913
Assignment of Assignor's Interest
Recorded: 2020-09-08
Pages: 6
Assignors
LAI, WEI-CHIH
Executed: 2020-08-11
CHIU, CHIEN-CHIA
Executed: 2020-08-11
YU, CHEN-HUA
Executed: 2020-08-12
YEH, DER-CHYANG
Executed: 2020-08-11
HSIEH, CHENG-HSIEN
Executed: 2020-08-11
HSU, LI-HAN
Executed: 2020-08-11
LIN, TSUNG-SHU
Executed: 2020-08-11
WU, WEI-CHENG
Executed: 2020-08-11
HSU, YU-CHEN
Executed: 2020-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof