Patent Assignment
Reel/Frame 053721/0275
Assignment of Assignor's Interest
Recorded: 2020-09-09
Pages: 6
Assignors
MUN, GEUMBI
Executed: 2020-06-29
KIM, JINYONG
Executed: 2020-07-21
LEE, JUNWON
Executed: 2020-06-29
HWANG, KWANGTAE
Executed: 2020-06-29
KIM, IKSOO
Executed: 2020-07-02
IM, JIWOON
Executed: 2020-07-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Material Film, Integrated Circuit Device, and Method of Manufacturing the Integrated Circuit Device