Patent Assignment
Reel/Frame 053723/0035
Assignment of Assignor's Interest
Recorded: 2020-09-09
Pages: 6
Assignors
SEOL, MINSU
Executed: 2020-08-31
SHIN, HYEONJIN
Executed: 2020-08-31
YOO, MINSEOK
Executed: 2020-08-31
LEE, MINHYUN
Executed: 2020-08-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Two-Dimensional Material-Based Wiring Conductive Layer Contact Structures, Electronic Devices Including the Same, and Methods of Manufacturing the Electronic Devices