Patent Assignment
Reel/Frame 053728/0758
Assignment of Assignor's Interest
Recorded: 2020-09-09
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2020-08-11
CHEN, HSIEN-WEI
Executed: 2020-08-07
CHEN, JIE
Executed: 2020-08-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method of Semiconductor Package