Patent Assignment
Reel/Frame 053728/0942
Assignment of Assignor's Interest
Recorded: 2020-09-10
Pages: 4
Assignors
LU, CHUN-LIN
Executed: 2020-08-18
WU, JIUN-YI
Executed: 2020-08-18
WU, KAI-CHIANG
Executed: 2020-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Fabricating Method Thereof