Patent Assignment
Reel/Frame 053731/0627
Assignment of Assignor's Interest
Recorded: 2020-09-10
Pages: 2
Assignor
SAWANOBORI, AKIHITO
Executed: 2020-09-04
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof