IP Library Assignment 053757/0537
Patent Assignment
Reel/Frame 053757/0537

Assignment of Assignor's Interest

Recorded: 2020-09-14 Pages: 3
Assignor
YOSHINO, HIDEO
Executed: 2020-09-04
Assignee
ABLIC INC.
3-9-6 MITA, MINATO-KU, TOKYO, 108-8330, JAPAN
Covered Property (1)
Semiconductor Device and Method of Manufacturing the Semiconductor Device
Application: 17/015,301 →
Publication: US 2021/0098291
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →