Patent Assignment
Reel/Frame 053761/0398
Assignment of Assignor's Interest
Recorded: 2020-09-14
Pages: 3
Assignee
LINTEC CORPORATION
23-23, HONCHO, ITABASHI-KU, TOKYO, 173-0001, JAPAN
Covered Property
(1)
Substrate for Release Sheets, and Release Sheet
Application:
16/980,628 →
Publication:
US 2021/0008833