Patent Assignment
Reel/Frame 053761/0449
Assignment of Assignor's Interest
Recorded: 2020-09-14
Pages: 2
Assignors
LIN, YUNG-CHI
Executed: 2020-08-25
WU, TSANG-JIUH
Executed: 2020-08-25
CHIOU, WEN-CHIH
Executed: 2020-08-25
YU, CHEN-HUA
Executed: 2020-08-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer Bonding Method