Patent Assignment
Reel/Frame 053762/0912
Assignment of Assignor's Interest
Recorded: 2020-09-14
Pages: 7
Assignors
KIGUCHI, KAZUYA
Executed: 2020-08-29
NISHIYAMA, TOMOO
Executed: 2020-09-01
FUJIMOTO, DAISUKE
Executed: 2020-08-26
SAKAMOTO, NORIHIKO
Executed: 2020-08-24
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin, Epoxy Resin Composition, Resin Sheet, B-Stage Sheet, C-Stage Sheet, Cured Product, Metal Foil with Resin, Metal Substrate, and Power Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →