IP Library Assignment 053777/0438
Patent Assignment
Reel/Frame 053777/0438

Assignment of Assignor's Interest

Recorded: 2020-09-15 Pages: 10
Assignors
YU, KAI-HUNG
Executed: 2020-09-14
GRZESKOWIAK, JODI
Executed: 2020-09-14
JOY, NICHOLAS
Executed: 2020-09-15
SMITH, JEFFREY
Executed: 2020-09-14
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property (1)
Method of Bottom-Up Metallization in a Recessed Feature
Application: 17/021,586 →
Publication: US 2021/0082750