Patent Assignment
Reel/Frame 053782/0786
Assignment of Assignor's Interest
Recorded: 2020-09-15
Pages: 4
Assignors
FUJII, HIDETOSHI
Executed: 2020-07-20
MORISADA, YOSHIAKI
Executed: 2020-07-20
LIU, HUIHONG
Executed: 2020-07-20
AOKI, YASUHIRO
Executed: 2020-07-20
KAMAI, MASAYOSHI
Executed: 2020-07-20
Assignee
OSAKA UNIVERSITY
1-1, YAMADAOKA, SUITA-SHI, OSAKA, 565-0871, JAPAN
Covered Property
(1)
Metal Material Solid-Phase Bonding Method and Solid-Phase Bonding Device