Patent Assignment
Reel/Frame 053795/0033
Assignment of Assignor's Interest
Recorded: 2020-09-16
Pages: 6
Assignors
KANAMORI, KOHJI
Executed: 2020-09-14
HAN, JEE HOON
Executed: 2020-09-14
KANG, SEO-GOO
Executed: 2020-09-14
RYU, HYO JOON
Executed: 2020-09-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
3D Semiconductor Memory Device and Method of Fabricating Same