Patent Assignment
Reel/Frame 053795/0350
Assignment of Assignor's Interest
Recorded: 2020-09-16
Pages: 4
Assignors
KE, PO-HSIEN
Executed: 2020-09-08
LEE, TECK-CHONG
Executed: 2020-09-08
HUNG, CHIH-PIN
Executed: 2020-09-08
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package Structure and Method for Manufacturing the Same