Patent Assignment
Reel/Frame 053798/0992
Assignment of Assignor's Interest
Recorded: 2020-09-17
Pages: 4
Assignors
SASAGAWA, KAKERU
Executed: 2020-06-23
YOKOTA, KEI
Executed: 2020-07-06
ANEGAWA, KENTA
Executed: 2020-06-24
YAMASHITA, SEIICHIRO
Executed: 2020-06-30
SHINBARU, YUJI
Executed: 2020-07-02
MARUYAMA, KAZUNOBU
Executed: 2020-06-26
MIYASHITA, DAICHI
Executed: 2020-06-25
TAKANO, HIROKI
Executed: 2020-06-26
HAYASHI, RIONA
Executed: 2020-06-25
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Injection Molding System and Method for Manufacturing Molded Object