Patent Assignment
Reel/Frame 053807/0486
Assignment of Assignor's Interest
Recorded: 2020-09-17
Pages: 5
Assignors
LI, LING-WEI
Executed: 2020-06-01
CHANG, JUNG-HUA
Executed: 2020-07-03
HUANG, CHENG-LIN
Executed: 2020-08-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package with Fan-Out Feature