Patent Assignment
Reel/Frame 053824/0384
Assignment of Assignor's Interest
Recorded: 2020-09-20
Pages: 4
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Apparatus and Method for Detecting Height of Bonding Target
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.