Patent Assignment
Reel/Frame 053834/0100
Assignment of Assignor's Interest
Recorded: 2020-09-21
Pages: 10
Assignors
PARK, SOOJAE
Executed: 2020-09-08
KANG, YOUNHEE
Executed: 2020-09-08
ROH, JUNGHYUN
Executed: 2020-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same