Patent Assignment
Reel/Frame 053837/0158
Assignment of Assignor's Interest
Recorded: 2020-09-22
Pages: 5
Assignors
CHEN, HSIEN-WEI
Executed: 2020-06-04
CHEN, JIE
Executed: 2020-06-04
CHEN, MING-FA
Executed: 2020-06-05
YEH, SUNG-FENG
Executed: 2020-06-04
CHEN, YING-JU
Executed: 2020-06-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Die Stack Structure and Manufacturing Method Thereof