IP Library › Assignment 053837/0794
Patent Assignment
Reel/Frame 053837/0794

Assignment of Assignor's Interest

Recorded: 2020-09-21 Pages: 2
Assignors
KIM, JUHYEOK
Executed: 2020-09-14
CHO, BOIK
Executed: 2020-09-14
HA, JIEUN
Executed: 2020-09-14
LEE, SANGEUN
Executed: 2020-09-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Heat Sink Fastening Structure
Application: 17/025,453 →
Publication: US 2021/0084745