Patent Assignment
Reel/Frame 053838/0706
Assignment of Assignor's Interest
Recorded: 2020-09-21
Pages: 3
Assignors
CHUNG, CHENG-TING
Executed: 2020-09-03
CHEN, HOU-YU
Executed: 2020-09-08
TSAI, CHING-WEI
Executed: 2020-09-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Backside Interconnect Structures for Semiconductor Devices and Methods of Forming the Same