Patent Assignment
Reel/Frame 053843/0275
Assignment of Assignor's Interest
Recorded: 2020-09-22
Pages: 3
Assignor
JEON, YOUNG HO
Executed: 2020-09-21
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.,
MAEYOUNG-RO 150 (MAETAN-DONG), YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Package and Manufacturing Method Thereof