Patent Assignment
Reel/Frame 053843/0769
Assignment of Assignor's Interest
Recorded: 2020-09-22
Pages: 7
Assignors
WATANABE, KATSUHIDE
Executed: 2020-08-24
SHIOKAWA, YOICHI
Executed: 2020-08-24
YAGI, KEITA
Executed: 2020-08-26
NAKAMURA, AKIRA
Executed: 2020-08-21
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Substrate Polishing Apparatus, Method of Creating Thickness Map, and Method of Polishing a Substrate