Patent Assignment
Reel/Frame 053853/0934
Assignment of Assignor's Interest
Recorded: 2020-09-23
Pages: 4
Assignors
HSU, CHIA-KUEI
Executed: 2020-09-11
YEW, MING-CHIH
Executed: 2020-09-11
YEH, SHU-SHEN
Executed: 2020-09-11
YANG, CHE-CHIA
Executed: 2020-09-11
LIN, PO-YAO
Executed: 2020-09-14
JENG, SHIN-PUU
Executed: 2020-09-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Bonded to a Redistribution Structure with Curved Conductive Lines