Patent Assignment
Reel/Frame 053877/0692
Assignment of Assignor's Interest
Recorded: 2020-09-24
Pages: 3
Assignors
HUANG, YI
Executed: 2018-07-11
LENERO, FERNANDO GONZALEZ
Executed: 2018-07-13
ZHAO, LIWEI
Executed: 2018-07-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Hybrid Socket for Higher Thermal Design Point Processor Support